Sciperio Patents Pump for High-Viscosity Materials in Additive Manufacturing
Sciperio has patented a new pump designed to enable additive manufacturing systems to dispense materials with viscosities exceeding 1 million centipoise, addressing a key challenge in direct write manufacturing.
Sciperio, the research and development division of nScrypt, has been granted a patent for a novel pump engineered for additive manufacturing (AM) systems. This new technology is specifically designed to handle materials with viscosities above 1 million centipoise, a range that has historically presented difficulties for conventional dispensing systems, often leading to defects.
The patent, officially U.S. Patent No. 12,654,396 B2 and titled “Pump for Additive Manufacturing,” underpins Sciperio’s QuantiHelix dispensing platform. According to nScrypt, this technology is already integrated into their current production systems.
Direct write manufacturing (DWM) processes frequently utilize challenging materials such as conductive inks, adhesives, epoxies, and biological substances. Sciperio notes that existing dispensing methods often struggle to maintain consistent material flow, particularly at the beginning and end of print paths or when printing intricate geometries. This inconsistency can result in issues like over-deposition or under-deposition, compromising the final product.
The newly patented system combines a servo-controlled progressive cavity pump with a servo-motor-driven valve. This integration allows for real-time adjustments to material flow, enabling accurate volumetric dispensing of high-viscosity materials while mitigating the defects typically associated with them. The patent lists five inventors: Paul I. Deffenbaugh, Michael W. Owens, Dr. Kenneth H. Church, Joshua Goldfarb, and Emily Sassano.
This patent addresses a significant bottleneck in additive manufacturing, particularly for direct write applications involving high-viscosity materials. By enabling precise dispensing of these challenging substances, Sciperio's technology advances the potential for additively manufactured electronics, printed sensors, and other complex components. This development supports the broader trend towards distributed manufacturing and point-of-need production, especially for defense applications where reliability in austere environments is critical.
Edited by the news editor with AI from the original report — please refer to the original source.